Board-Level Underfill

The Electronic Components and Technology Conference (ECTC), scheduled for May 28 - 31, 2024 in Denver, CO, is a leading international event focusing on the latest developments in packaging, components, and microelectronic systems. This conference facilitates cooperation and technical exchange among industry experts. Panasonic's Tomo Muguruma will present a paper on the development of ultra-low CTE materials for advanced packaging. Visit Panasonic at booth #534 for more information.