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Panasonic Engages in Joint Research on Ultra-light EMC Shielding Material Development

Ultra-light weight at 1/270 the bulk density of aluminum

Reduces weight in applications such as spacecraft, eVTOL vehicles, and 5G/6G base stations

Panasonic has embarked on a joint research project on ultra-light EMC shielding material technology with the Japan Aerospace Exploration Agency, National Research and Development Agency (JAXA). The goal is to reduce the weight of satellites through wireless in-flight communication. This requires advanced electromagnetic shielding technology to ensure electromagnetic compatibility (EMC).

New Temperature-Resistant Sidefill for Surface Mount Assembly Reinforcement

Ideal for automotive electronics which need to function under extreme conditions, this Sidefill contributes to improved reliability of surface mount semiconductor packages and enables easier handling during manufacture due to long pot life.

Applications include automotive camera modules, automotive communication radar, automotive electronic control units (ECUs), next-generation cockpits, and headlights.