Panasonic Engages in Joint Research on Ultra-light EMC Shielding Material Development
Ultra-light weight at 1/270 the bulk density of aluminum
Reduces weight in applications such as spacecraft, eVTOL vehicles, and 5G/6G base stations
Panasonic has embarked on a joint research project on ultra-light EMC shielding material technology with the Japan Aerospace Exploration Agency, National Research and Development Agency (JAXA). The goal is to reduce the weight of satellites through wireless in-flight communication. This requires advanced electromagnetic shielding technology to ensure electromagnetic compatibility (EMC).
Panasonic Presents at TechBlick 2021
Panasonic To Present At The TechBlick 2021 Virtual Event For Electronic Textiles And Skin Patches For Hardware And Software
Panasonic's Technology Development Manager For The Electronic Materials Division, Takatoshi Abe, Will Present The Development Of A Unique High-Temperature Substrate For Stretchable Printed Electronics On October 13, 2021.
New Temperature-Resistant Sidefill for Surface Mount Assembly Reinforcement
Ideal for automotive electronics which need to function under extreme conditions, this Sidefill contributes to improved reliability of surface mount semiconductor packages and enables easier handling during manufacture due to long pot life.
Applications include automotive camera modules, automotive communication radar, automotive electronic control units (ECUs), next-generation cockpits, and headlights.
Electronic Assembly Materials
Panasonic Electronic Materials provides a variety of high-quality Electronic Assembly Materials, including adhesives and Surface Mount Technology (SMT) reinforcement materials such as Underfills, Sidefills and Corner Bond Adhesives.