Panasonic Engages in Joint Research on Ultra-light EMC Shielding Material Development

Ultra-light weight at 1/270 the bulk density of aluminum

Reduces weight in applications such as spacecraft, eVTOL vehicles, and 5G/6G base stations

Panasonic has embarked on a joint research project on ultra-light EMC shielding material technology with the Japan Aerospace Exploration Agency, National Research and Development Agency (JAXA). The goal is to reduce the weight of satellites through wireless in-flight communication. This requires advanced electromagnetic shielding technology to ensure electromagnetic compatibility (EMC). Electric aircraft with lower environmental impact, such as drones and eVTOL that fly near the ground, would also benefit from reduced weight and reduced electromagnetic interference. And, as 5G and 6G increase in speed and use higher frequencies, the need for electromagnetic shielding materials that are lightweight and work with the millimetre- to terahertz-wave bands will increase.

By combining a unique resin formulation technology, refined over many years, with environmental testing capabilities and expertise that anticipates a variety of use cases, Panasonic is aiming to commercialize the ultra-light EMC shielding material technology in 2024.

Designated as one of JAXA’s solution-creating research projects for space exploration, this effort is being undertaken jointly with Nagoya University, Yamagata University, and Akita University -- with Panasonic Industry serving as the representative organization.

Features

• With light weight and electromagnetic shielding performance equivalent to aluminum, this technology can help reduce weight and extend flight range for satellites, probes, drones and eVTOL vehicles
• Can adjust shielding performance of new materials according to device frequencies, facilitating EMC design and helping improve communication quality
• Excellent workability enables creation of 3D structures, contributing to improved design quality

Applications

• Spacecraft (such as satellites and probes)
• Electric aircraft (drones, eVTOL vehicles)
• Devices for 5G/6G applications (mobile base stations)
• Industrial equipment (robots, AGVs)
• In-vehicle devices (millimeter-wave radar, various sensors)
• VR/AR devices

Read here about our current experiments aboard the International Space Station using a variety of electronic materials products. These products -- MEGTRON series multi-layer circuit board materials, FELIOS series of flexible circuit board materials, and LEXCM series assembly materials -- are widely used in aerospace, automotive and telecommunications infrastructure.