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How Advances in Rigid and Flexible Circuit Materials Impact PWB Design in 2025

Panasonic's Darren Hitchcock will present a session on how advances in rigid and flexible circuit materials impact PWB design at the NEDME conference on October 22.

The NW Electronics Design & Manufacturing Expo (NEDME) is the premier trade show and networking event for members of the high-tech industry in the Pacific northwest. 

Darren's session focuses on new and advanced technologies for printed circuit board and flexible circuit raw materials, touching on the move toward smooth copper and low-loss dielectric materials for improved signal integrity. 

Panasonic Electronic Materials Presents at ECTC 2024

The Electronic Components and Technology Conference (ECTC), scheduled for May 28 - 31, 2024 in Denver, CO, is a leading international event focusing on the latest developments in packaging, components, and microelectronic systems. This conference facilitates cooperation and technical exchange among industry experts. Panasonic's Tomo Muguruma will present a paper on the development of ultra-low CTE materials for advanced packaging. Visit Panasonic at booth #534 for more information.

Webinar: How do material properties affect PCB design and manufacturing?

In a free PCEA member webinar, presenters from Panasonic's EMBD division, including Tony Senese and Eriko Yamato, discuss the crucial electrical, mechanical, and thermal properties of PCB materials. They explain key terms like Tg, CTE, Z-axis expansion, various moduli, elongation, tensile strength, dielectric strength, and peel strength. The webinar helps engineers understand these properties, their testing methods, and their significance, aiding in the selection of the best PCB materials for specific applications. Charts and expert insights guide participants on what to look for in material properties.

WEBINAR: BEYOLEX™ High-Temperature Stretchable Film for Soft-Circuit Applications

Join Andy Behr, Business Director of Panasonic Electronic Materials in North America, for an informative seminar on November 30, 2023, from 11:00 AM to 11:30 EST. He will provide an overview of BEYOLEX™, a novel thermosetting stretchable film designed for the next generation of flexible electronics suitable for health, medical, automotive, aerospace, sensors, and IoT applications. The session will also cover the process of printing on BEYOLEX™ using Voltera’s NOVA micro-dispensing system and ACI Materials SE 1109 stretchable silver ink. To learn more and engage with the topic, participants are encouraged to register for the seminar.

Panasonic’s Electronic Materials Prove Durable In Space

Panasonic Industry recently concluded exposure experiments of its circuit board materials at the International Space Station (ISS), confirming their high quality and durability in the harsh space environment. The materials were tested under conditions of microgravity, vacuum, cosmic radiation, and extreme temperatures. After a three-month exposure, the materials were returned and inspected by NASA and JAXA, showing no changes in appearance, electrical characteristics, or chemical composition. Further evaluations on thermal properties and structural observations are planned. This research supports advancements in high-speed and non-ground-level communication technologies, crucial for 6G networks and applications like space exploration and High-Altitude Platform Stations (HAPS). Tested materials include the MEGTRON, FELIOS, LEXCM GX, XPEDION, and HIPER V series.

Panasonic Electronic Materials Presents Technical Paper at APEX 2023

Apex 2023 is the largest event in North America for the electronics manufacturing industry. This year's theme, Advance in a New Era of Electronics Manufacturing, aligns with Panasonic's technical paper presentation on an exciting new pliable, conformable circuit board material.

The paper, presented by Tomohiro Fukao, Research Manager of the Electronic Materials Division of Panasonic Corporation of North America, contrasts the history of printed circuit boards being hard and rectangular and the possibilities of soft, flexible substrates.

Panasonic Engages in Joint Research on Ultra-light EMC Shielding Material Development

Ultra-light weight at 1/270 the bulk density of aluminum

Reduces weight in applications such as spacecraft, eVTOL vehicles, and 5G/6G base stations

Panasonic has embarked on a joint research project on ultra-light EMC shielding material technology with the Japan Aerospace Exploration Agency, National Research and Development Agency (JAXA). The goal is to reduce the weight of satellites through wireless in-flight communication. This requires advanced electromagnetic shielding technology to ensure electromagnetic compatibility (EMC).

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