Electronic Materials

Panasonic exhibits at the largest online gathering of the printed, hybrid, inmold, and 3D electronics community.

Andy Behr, Technology Manager with Panasonic's Electronic Materials Division, will showcase recent product developments for flexible printed electronics. This includes BEYOLEX™ Thermosetting Stretchable Film.

Panasonic BEYOLEX™ Film is a Novel Polymer Substrate Designed for Flexible, Stretchable, Conformable, and Pliable Printed Electronics Applications

Panasonic is proud to introduce BEYOLEX™, a new thermoset stretchable film polymer substrate for printed electronics.

Panasonic To Present At The TechBlick 2021 Virtual Event For Electronic Textiles And Skin Patches For Hardware And Software

Panasonic's Technology Development Manager For The Electronic Materials Division, Takatoshi Abe, Will Present The Development Of A Unique High-Temperature Substrate For Stretchable Printed Electronics On October 13, 2021. 

Panasonic's new semiconductor packaging material, R-1515V, enables both low package warpage and high assembly-level reliability. This new material has very low thermal expansion properties which reduces the warping of the substrate during the packaging process. Its optimized mechanical properties lower the residual stress on solder joints, created during reflow assembly, to improve reliability.

Suitable for IoT, V2X, 5G and other leading-edge technologies.

Now available is Panasonic’s new halogen-free, ultra-low transmission loss multi-layer Circuit Board Prepreg. This new Prepreg enables multi-layer millimeter wave antenna construction using industry-standard manufacturing processes and equipment.

Applications include millimeter-wave antenna Circuit Boards, automotive millimeter-wave radar, wireless communication base stations and high-transmission speed multi-layer Circuit Boards.

Key benefits include lower transmission loss, ease of construction, and reduced manufacturing costs.

Ideal for automotive electronics which need to function under extreme conditions, this Sidefill contributes to improved reliability of surface mount semiconductor packages and enables easier handling during manufacture due to long pot life.

Applications include automotive camera modules, automotive communication radar, automotive electronic control units (ECUs), next-generation cockpits, and headlights.

Panasonic offers a wide range of specialty encapsulation materials for laminate-based semiconductor packaging designs. These products provide an unmatched combination of performance, processability, and reliability.

Panasonic is one of the most recognized names in Circuit Board Materials offering one of the broadest product portfolios in the industry ranging from flexible circuit materials to Halogen-Free materials, to ultra-high speed/low loss materials.

High Performance, High Quality, High Reliability

Introducing the Electronic Materials product line, providing high-performance products for Printed Circuit Board fabrication and Semiconductor packaging.

The Panasonic RUGGED RANTS Podcast provides a tough and at times a bold conversation on the future of innovation and what we can expect as work changes.

Hosted by Panasonic TOUGHBOOK's Barry Ross, Episode 20: What Do Smart Clothing & Foldable Phones Have In Common? features a candid conversation with Mr. Nick DeGaetano from Panasonic Industrial’s New Business Development Team.  Nick helps RUGGED RANTS listeners figure out just exactly what are “Flexible Electronics” and how Wearables and apparel are benefiting from this technology.