Electronic Materials

Panasonic Industry Co., Ltd announced plans to investigate the impact of the space environment on electronic materials and aid future product development for aerospace applications.  Materials to be tested include high-performance circuit board laminates and underfills for board-level reinforcement. These materials will be launched into space next year and positioned on the Exposed Facility of the Japanese Experiment Module Kibo on the International Space Station (ISS) for six months.

At the event covering printed, hybrid, 3D, inmold, and textile electronics, Panasonic's Electronic Materials Division will discuss the projects made with high-temperature-tolerant stretchable substrate. This is a chance to see how Panasonic's new BEYOLEX™ Thermosetting Stretchable Film can be used. 

Panasonic exhibits at the largest online gathering of the printed, hybrid, inmold, and 3D electronics community.

Andy Behr, Technology Manager with Panasonic's Electronic Materials Division, will showcase recent product developments for flexible printed electronics. This includes BEYOLEX™ Thermosetting Stretchable Film.

Panasonic BEYOLEX™ Film is a Novel Polymer Substrate Designed for Flexible, Stretchable, Conformable, and Pliable Printed Electronics Applications

Panasonic is proud to introduce BEYOLEX™, a new thermoset stretchable film polymer substrate for printed electronics.

Panasonic To Present At The TechBlick 2021 Virtual Event For Electronic Textiles And Skin Patches For Hardware And Software

Panasonic's Technology Development Manager For The Electronic Materials Division, Takatoshi Abe, Will Present The Development Of A Unique High-Temperature Substrate For Stretchable Printed Electronics On October 13, 2021. 

Panasonic's new semiconductor packaging material, R-1515V, enables both low package warpage and high assembly-level reliability. This new material has very low thermal expansion properties which reduces the warping of the substrate during the packaging process. Its optimized mechanical properties lower the residual stress on solder joints, created during reflow assembly, to improve reliability.

Suitable for IoT, V2X, 5G and other leading-edge technologies.

Now available is Panasonic’s new halogen-free, ultra-low transmission loss multi-layer Circuit Board Prepreg. This new Prepreg enables multi-layer millimeter wave antenna construction using industry-standard manufacturing processes and equipment.

Applications include millimeter-wave antenna Circuit Boards, automotive millimeter-wave radar, wireless communication base stations and high-transmission speed multi-layer Circuit Boards.

Key benefits include lower transmission loss, ease of construction, and reduced manufacturing costs.

Ideal for automotive electronics which need to function under extreme conditions, this Sidefill contributes to improved reliability of surface mount semiconductor packages and enables easier handling during manufacture due to long pot life.

Applications include automotive camera modules, automotive communication radar, automotive electronic control units (ECUs), next-generation cockpits, and headlights.

Panasonic offers a wide range of specialty encapsulation materials for laminate-based semiconductor packaging designs. These products provide an unmatched combination of performance, processability, and reliability.

Panasonic is one of the most recognized names in Circuit Board Materials offering one of the broadest product portfolios in the industry ranging from flexible circuit materials to Halogen-Free materials, to ultra-high speed/low loss materials.