New Semiconductor Substrate Material, R-1515V, Improves Assembly-Level Reliability

Panasonic's new semiconductor packaging material, R-1515V, enables both low package warpage and high assembly-level reliability. This new material has very low thermal expansion properties which reduces the warping of the substrate during the packaging process. Its optimized mechanical properties lower the residual stress on solder joints, created during reflow assembly, to improve reliability.

Suitable for IoT, V2X, 5G and other leading-edge technologies.