Learn the basics of EMC and MUF technology in our video primers
Two videos are available that cover the basics of epoxy mold compound (EMC) technology and molded underfill (MUF) technology. Join our expert, Dr. Ke Chen, as he reviews the basics and learn how these leading edge materials prepare semiconductors to meet the world and keep them safe.
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New Semiconductor Substrate Material, R-1515V, Improves Assembly-Level Reliability
Panasonic's new semiconductor packaging material, R-1515V, enables both low package warpage and high assembly-level reliability. This new material has very low thermal expansion properties which reduces the warping of the substrate during the packaging process. Its optimized mechanical properties lower the residual stress on solder joints, created during reflow assembly, to improve reliability.
Suitable for IoT, V2X, 5G and other leading-edge technologies.
Introducing Panasonic IC Packaging Materials
Panasonic offers a wide range of specialty encapsulation materials for laminate-based semiconductor packaging designs. These products provide an unmatched combination of performance, processability, and reliability.
Introducing the Electronic Materials Product Line
High Performance, High Quality, High Reliability
Introducing the Electronic Materials product line, providing high-performance products for Printed Circuit Board fabrication and Semiconductor packaging.