The Electronic Components and Technology Conference (ECTC) is the premier international conference that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. The conference runs May 28 - 31, 2024 in Denver, CO.
Panasonic's Tomo Muguruma will be presenting a paper, Development of Thick Core Material for Leading-Edge Packaging, outlining the progress towards ultra-low CTE materials. Find Panasonic at booth #534 for more information.
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Best-in-class processing and readily available in North America: MEGTRON, Hiper, Felios
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<h1><span style="color:#00457c;">HIGH PERFORMANCE CIRCUIT BOARD MATERIALS </span></h1>
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