PIM ID
472
New Temperature-Resistant Sidefill for Surface Mount Assembly Reinforcement
Ideal for automotive electronics which need to function under extreme conditions, this Sidefill contributes to improved reliability of surface mount semiconductor packages and enables easier handling during manufacture due to long pot life.
Applications include automotive camera modules, automotive communication radar, automotive electronic control units (ECUs), next-generation cockpits, and headlights.
Sidefill And Corner Bond
Panasonic Electronic Materials offers a variety of Sidefill and Corner Bond products, including materials designed specifically to increase the reliability of automotive circuit board assemblies.