Panasonic Industry 5G Connectors and Relay Solutions for Data Centers

Over decades of innovation, Panasonic Industry has established itself as a leader in electronic components and solutions, offering cutting-edge and reliable products for a wide range of applications. As the demand for high-speed, low-latency communication continues to rise, 5G technology is playing a crucial role in shaping the future of data centers. The rapid expansion of these networks has introduced new challenges in connectivity, power distribution, and signal integrity, requiring advanced components designed to meet these demanding requirements.

TDC and TQC Series POSCAP™ Capacitors

The expanded TDC Series and TQC Series POSCAP™ Capacitors now offer B2 case-sized parts that comply with JEDEC reflow conditions.  

Panasonic's TDC Series Capacitors are ideal for environments requiring extremely high temperatures and high endurance of up to 1,000 hours at 125ºC.  The TQC Series Capacitors utilize a sintered tantalum anode and a proprietary high-conductivity polymer for a cathode.

AQY206GV PhotoMOS® HF SSOP Type Relay with 600 V High Capacity

Compact semiconductor device capable of 600 V load control for test and measurement applications

Panasonic HF SSOP 1 Form A High Capacity PhotoMOS® Semiconductor Relays are equipped in a miniature SSOP package for high-density mounting and are rated at 600V and 150mA. The HF SSOP Relays are suitable for applications ranging from test and measurement equipment to industrial applications. These PhotoMOS® Semiconductors Relays feature low on-resistance of 8 Ohms, high-speed operation, and an isolation voltage of 1500Vrms.

PAN W602-x Wi-Fi 6 RF Module

Cost effective WiFi 6: PAN W602 Series – Add WiFi 6 now more easily and cost-effectively than ever before!

The PAN W602-1 is a single band 2.4 GHz companion module with integrated Bluetooth Low Energy (LE) for cost-effective projects and is based on the chipset CC3301 from Texas Instruments.

The PAN W602-2 is a dual band 2.4 & 5 GHz companion module with integrated Bluetooth Low Energy (LE) for projects which require more data rates or less interferences and is based on the chipset CC3351 from Texas Instruments.