What's New

Where Should You Begin Your Industry 4.0 and IIoT Journey? Hosted by Christina Pierce 

Are you attending Automate 2022? Check out Panasonic's speaking engagement during the AI & Smart Automation track, hosted by Christina Pierce, Sales Operations Manager for Panasonic IIoT Solutions.

Track: AI & Smart Automation

Session Title: Where Should You Begin Your Industry 4.0 and IIoT Journey?

Session Date: Monday, June 6, 2022

PhotoMOS® CC TSON 1 Form B Semiconductor Relays

Low Current and High Temperature in a Miniature Thin Slim Outline Non-lead Package 

Panasonic, a worldwide leader in Relay Products, announces the PhotoMOS® CC Semiconductor Relay with a super small TSON package, an oscillation circuit, and a built-in capacitor coupled isolation driver IC. These PhotoMOS CC Relays are the latest version of this technology, which now is available as a 1 Form B, customarily closed, contact arrangement.

Panasonic’s Newest High-Reliability SP-Caps™! Extremely Durable Under High Temperature and High Humidity Conditions, Long Product Life, and Low 9 mΩ Max. ESR

Panasonic, a worldwide leader in Capacitor Products, announces the New EEF-JX Series Surface Mount Specialty Conductive Polymer Aluminum Electrolytic Capacitors featuring high endurance of 3,000 hours at 125°C, providing extremely long life when designed in!

Panasonic exhibits at the largest online gathering of the printed, hybrid, inmold, and 3D electronics community.

Andy Behr, Technology Manager with Panasonic's Electronic Materials Division, will showcase recent product developments for flexible printed electronics. This includes BEYOLEX™ Thermosetting Stretchable Film.

Panasonic’s Next Generation Wi-Fi and Bluetooth® 5.2 Dual Band RF Module Featuring a Fast Dual-Core CPU, High-Speed Data Interface, and 802.11i Security Standard Providing the Highest Flexibility for Wireless Connectivity

The PAN9028 Series Wi-Fi and Bluetooth® 5.2 Dual Band Combo Module features 2.4 GHz and 5 GHz while supporting 802.11i a/b/g/n/ac security standards through AES, CCMP, and other security mechanisms.

Panasonic BEYOLEX™ Film is a Novel Polymer Substrate Designed for Flexible, Stretchable, Conformable, and Pliable Printed Electronics Applications

Panasonic is proud to introduce BEYOLEX™, a new thermoset stretchable film polymer substrate for printed electronics.

Panasonic To Present At The TechBlick 2021 Virtual Event For Electronic Textiles And Skin Patches For Hardware And Software

Panasonic's Technology Development Manager For The Electronic Materials Division, Takatoshi Abe, Will Present The Development Of A Unique High-Temperature Substrate For Stretchable Printed Electronics On October 13, 2021. 

PAN9520 Series Embedded 2.4 GHz Wi-Fi® 802.11 b/g/n RF Modules

Panasonic’s Newest Bluetooth® 5.3 Low Energy RF Module Based On The Nordic nRF52820 Single-Chip Controller For IoT Applications Where A Long Range Is Required

Introducing Panasonic’s NEW PAN1781 Series RF Module … yet another high technology Panasonic RF Module device featuring the Nordic nRF52820 Single-Chip Controller. This newest addition to the Panasonic Wireless Connectivity RF Module product line is ideal for IoT Wireless Connectivity applications!

Panasonic's new semiconductor packaging material, R-1515V, enables both low package warpage and high assembly-level reliability. This new material has very low thermal expansion properties which reduces the warping of the substrate during the packaging process. Its optimized mechanical properties lower the residual stress on solder joints, created during reflow assembly, to improve reliability.

Suitable for IoT, V2X, 5G and other leading-edge technologies.