Line Extension LE Type (Performance Effective) ETQP4M***KF* Series Automotive Power Inductors
Panasonic, a worldwide leader in Inductor Products, announces the expansion of the LE Type (Performance Effective) ETQP4M***KF* Series of Power Inductors for Automotive Applications. The new ETQ-P4M470KFN Power Inductor provides exceptional large current support, high heat resistance, and high vibration resistance.
TDC and TQC Series POSCAP™ Tantalum Polymer Capacitors Line Extension
The expanded TDC Series and TQC Series POSCAP™ Capacitors now offer parts in the D2 case size that comply with JEDEC reflow c
Line Extension LP (Low Profile) Type – ETQP*M***KV* Series Automotive Inductors
Panasonic, a worldwide leader in Inductor Products, announces the new ETQ-P4MR47KVK Power Inductor, part of the LP (Low Profile) Type Series of Power Choke Coils. This new Inductor provides exceptional large current support, high heat resistance, and high vibration resistance.
Visit Us at Humanoids Summit 2025
Explore Panasonic's Innovations at Humanoids Summit 2025
Panasonic Industry will exhibit at Humanoids Summit 2025, showcasing our advanced technologies for motion and control, manipulation, and safety, including Servo Motors, Tactile Sensors, Optical Connectors, and EDLC Capacitor technologies. These technologies enable precise manipulation, reliable power management, EMI-free data transmission, and flexible form factors for advanced robotic applications.
High Performance Passive Infrared Motion Sensors - PaPIRS+
Panasonic’s Next Generation, High-Performance Passive Infrared Motion Sensors - PaPIRs+
Panasonic Industry proudly introduces the next evolution in Passive Infrared (PIR) Motion Sensors - PaPIRs+. These cutting-edge sensors deliver a major advancement in motion detection, highlighting enhanced sensitivity, effortless integration, and ultra-low power consumption.
EV-B Series Automotive Relay (DC Contactor)
High Cut-Off Capacity 2,000A at 500V DC!
Panasonic, a worldwide leader in Relay Products, introduces the new EV-B Series Automotive Relay (DC Contactor)!
SXV Series OS-CON™ Increased Capacitance For High-Voltage Parts (up to 800V)
How Advances in Rigid and Flexible Circuit Materials Impact PWB Design in 2025
Panasonic's Darren Hitchcock will present a session on how advances in rigid and flexible circuit materials impact PWB design at the NEDME conference on October 22.
The NW Electronics Design & Manufacturing Expo (NEDME) is the premier trade show and networking event for members of the high-tech industry in the Pacific northwest.
Darren's session focuses on new and advanced technologies for printed circuit board and flexible circuit raw materials, touching on the move toward smooth copper and low-loss dielectric materials for improved signal integrity.
Learn the basics of EMC and MUF technology in our video primers
Two videos are available that cover the basics of epoxy mold compound (EMC) technology and molded underfill (MUF) technology. Join our expert, Dr. Ke Chen, as he reviews the basics and learn how these leading edge materials prepare semiconductors to meet the world and keep them safe.
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PAN B611-1x Bluetooth® 6 Low Energy Module
Panasonic Industry's next gen Bluetooth 6 Module with a hybrid Castellated holes & LGA footprint design intended for cost-effective, high performance Bluetooth Low Energy applications.
The PAN B611-1x is a Bluetooth 6 Low Energy (LE) module based on the Nordic nRF54L15 single chip controller.