Panasonic Electronic Materials Has Developed A Wide Range Of Semiconductor Encapsulation Materials For Fan Out Wafer Level Packaging (FO-WLP) And Panel Level Packaging (PLP)

From leading-edge granule Epoxy Mold Compounds (EMC) for compression and transfer molding, to liquid encapsulants for compression molding, Panasonic materials for FO-WLP and PLP offer an unmatched combination of performance, processability and reliability.

Panasonic is pioneering liquid materials and sheet lamination materials as alternative solutions to traditional packaging technologies.

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IC Encapsulants - Wafer Level Packages
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Wafer Level Packaging Overview
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Panasonic offers a range of semiconductor encapsulation materials for Fan Out Wafer Level Packaging (FO-WLP) and Panel Level Packaging (PLP), including granule Epoxy Mold Compounds (EMC) and liquid encapsulants for compression molding. They are also developing liquid and sheet lamination materials as innovative alternatives to traditional packaging technologies.

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