IC Encapsulants - Wafer Level Packages - Electronic Materials

Panasonic Electronic Materials Has Developed A Wide Range Of Semiconductor Encapsulation Materials For Fan Out Wafer Level Packaging (FO-WLP) And Panel Level Packaging (PLP)

From leading-edge granule Epoxy Mold Compounds (EMC) for compression and transfer molding, to liquid encapsulants for compression molding, Panasonic materials for FO-WLP and PLP offer an unmatched combination of performance, processability and reliability.

Panasonic is pioneering liquid materials and sheet lamination materials as alternative solutions to traditional packaging technologies.