Panasonic's leading-edge IC Substrate materials enable next-generation Semiconductor packaging designs and can meet the challenge of emerging heterogeneous advanced package architectures.
These high-performance materials are available for a range of package formats including flip chip ball grid array (fcBGA), chip-scale packages (CSP) and flip chip chip-scale packages (fcCSP).
These Substrates are perfect for the new devices with low package profiles, high I/O counts, better Thermal Management requirements and improved signal integrity required by markets like Wearables, the Internet of Things (IoT) and 5G Networks. Panasonic advanced Substrates offer low-stress technology and the best warpage control in the IC Packaging Industry.
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Panasonic's advanced IC Substrate materials support next-generation semiconductor packaging, ideal for formats like fcBGA, CSP, and fcCSP. These substrates meet the demands of low-profile packages, high I/O counts, and improved thermal management for applications in wearables, IoT, and 5G networks. They feature low-stress technology and superior warpage control.