Flexible Circuit Board Materials Suitable For A Wide Range of Applications
Featuring Felios Polyimide (R-F775 for double-side and R-F770 for single side), Felios Liquid Crystal Polymer (R-F705S), and Felios Flexible Resin-Coated Copper foil (R-FR10)
Felios Adhesiveless Flex Circuit Board Materials are available in a variety of film and copper foil thicknesses to support many applications. The Flexible Circuit Board laminates offer superior thermal resistance, dimensional stability and quality. All are suitable for a wide range of end-use products such as mobile devices as well as medical, industrial and avionics applications.
Panasonic's Felios Adhesiveless Flex Circuit Board Materials offer superior thermal resistance and dimensional stability, available in various film and copper foil thicknesses. They are suitable for a wide range of applications, including mobile devices, medical, industrial, and avionics.