Flexible Circuit Board Materials Suitable For A Wide Range of Applications
Featuring Felios Polyimide (R-F775 for double-side and R-F770 for single side), Felios Liquid Crystal Polymer (R-F705S), and Felios Flexible Resin-Coated Copper foil (R-FR10)
Felios Adhesiveless Flex Circuit Board Materials are available in a variety of film and copper foil thicknesses to support many applications. The Flexible Circuit Board laminates offer superior thermal resistance, dimensional stability and quality. All are suitable for a wide range of end-use products such as mobile devices as well as medical, industrial and avionics applications.
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Panasonic's Felios Adhesiveless Flex Circuit Board Materials offer superior thermal resistance and dimensional stability, available in various film and copper foil thicknesses. They are suitable for a wide range of applications, including mobile devices, medical, industrial, and avionics.